焊垫结构,防止金属间介电开裂和提高可焊性

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【标题】焊垫结构,防止金属间介电开裂和提高可焊性

【发明人】 Huang  Yung-Sheng  Lin  Chiu-Ching  Lu  Chun-Hung  Hwang  Ruey-Lian 

【公开日期】2001-10-23

【分类号】H01L 2144

【摘要】A process of forming a bond pad structure, with a roughened top surface topography, used to improve the bondability of a gold wire bond, to the underlying bond pad structure, has been developed. The process features the use of a tungsten mesh pattern, formed in an IMD layer, and located underlying the bond pad structure, while overlying, and contacting, an underlying upper level, metal interconnect structure. The use of a tungsten mesh pattern, in place of individual tungsten studs, results in the creation of isolated islands, of IMED, reducing the bonding force, experienced by the IMD shapes, during the subsequent gold wire bond procedure. In addition the tungsten mesh pattern is formed via partial filling of a mesh pattern opening, in the IMD layer, resulting in an indented, or notched top surface. This in turn allows a roughened top surface, for the overlying bond pad structure, to be created, resulting in improved bondability of the gold wire, to the roughened top surface of the bond pad structure.

【申请号】483934&

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